Chassis with repositionable plates

ABSTRACT

Methods, systems and devices are described for a chassis with repositionable plates. An apparatus, including a chassis having a first module bay with a first plate mounting bracket, a second module bay with a second plate mounting bracket and a repositionable plate that is removably connectable to the first plate mounting bracket and removably connectable to said second plate mounting bracket.

BACKGROUND OF THE INVENTION

I. Field of the Invention

The invention relates generally to the field of electrical equipment.More particularly, the invention relates to chassis mounted modularelectrical equipment.

II. Description of Related Art

An electrical chassis should allow for custom configurations and arelatively high density of components. A modular design of both thechassis and the equipment modules provides a customer with the abilityto easily select and install the equipment modules necessary for aspecific application.

Designs of electrical equipment generally include a chassis with aplurality of individual components and assemblies mounted therein andconnected to the chassis and/or to one another by one or more bus,wires, cables, brackets, nuts, bolts and the like. The modularity ofelectrical systems is an important design consideration. Modules can beremoved and examined for operability, replaced, or repositioned mucheasier than permanently mounted fixtures within a rack or chassis. It isimportant to maintain the reliability and integrity of the system. Whenthe various elements of an electrical system can be easily removed in amodular form, they can also be easily replaced to maintain theoperational status of the electrical system. A chassis preferablyensures easy access, simple installation and fast maintenance.

Most chassis designs are restricted in the location and orientation ofmodular components placed in the chassis. For example, the bays for themodular components typically allow only for entry from the rear of thechassis. What is required is an approach that allows flexibility in thelocation and orientation of modular components within the chassis. Theinvention is directed to meeting these requirements, among others.

SUMMARY OF THE INVENTION

Thus, there is need for the following embodiments. One embodiment of theinvention is based on an apparatus, comprising a chassis including afirst module bay and a second module bay, said first module bay and saidsecond module bay together composing both a forward section and rearwardsection.

Another embodiment of the invention is based on a method, comprisingproviding a chassis with a first module bay and a second module bay,said first module bay and said second module bay together composing aforward section and rearward section.

Another embodiment of the invention is based on a kit, comprising achassis including a first module bay and a second module bay, said firstmodule bay and said second module bay together composing both a forwardsection and a rearward section.

Another embodiment of the invention is based on an apparatus comprisinga chassis including a first module bay having a first plate mountingbracket and a second module bay having a second plate mounting bracket;and a repositionable plate that is removably connectable to said firstplate mounting bracket and removably connectable to said second platemounting bracket. Further embodiments of the current invention comprisea communications network, comprising the apparatus described hereinaboveand a method for deploying a communications network.

Another embodiment of the invention is based on a method comprising:providing a chassis with a first module bay having a first platemounting bracket and a second module bay having a second plate mountingbracket; and connecting a repositionable plate to said first platemounting bracket, said repositionable plate removable from said firstplate mounting bracket and removably connectable to said second platemounting bracket.

Another embodiment of the invention comprises a kit, comprising: achassis including a first module bay having a first plate mountingbracket and a second module bay having a second plate mounting bracket;and a repositionable plate that is removably connectable to said firstplate mounting bracket and removably connectable to said second platemounting bracket.

These, and other embodiments of the invention will be better appreciatedand understood when considered in conjunction with the followingdescription and the accompanying drawings. It should be understood,however, that the following description, while indicating preferredembodiments of the invention and numerous specific details thereof, isgiven by way of illustration and not of limitation. Many changes andmodifications may be made within the scope of the invention withoutdeparting from the spirit thereof, and the invention includes all suchmodifications.

BRIEF DESCRIPTION OF THE DRAWINGS

A clear conception of the advantages and features constituting theinvention, and of the components and operation of model systems providedwith the invention, will become more readily apparent by referring tothe exemplary, and therefore nonlimiting, embodiments illustrated in thedrawings accompanying and forming a part of this specification, whereinlike reference characters designate the same parts. It should be notedthat the features illustrated in the drawings are not necessarily drawnto scale.

FIGS. 1A-1C illustrate orthographic views of a module representing anembodiment of the invention.

FIGS. 2A-2C illustrate orthographic views of a repositionable plate thatcan be used with the module of FIGS. 1A-1C, representing an embodimentof the invention.

FIGS. 3A-3C illustrate orthographic views of another module,representing an embodiment of the invention.

FIGS. 4A-4C illustrate orthographic views of a repositionable plate thatcan be used with the module of FIGS. 3A-3C representing an embodiment ofthe invention.

FIGS. 5A-5C illustrate orthographic views of a chassis, representing anembodiment of the invention.

FIGS. 6A and 6B illustrate orthographic views of the module,repositionable plate and chassis depicted in FIGS. 3A-3C, 4A-4C and5A-5C, respectively.

FIGS. 7A and 7B illustrate orthographic views of the modulerepositionable plate and chassis depicted in FIGS. 1A-1C, 2A-2C and5A-5C, respectively.

FIG. 8 illustrates a schematic view of a chassis comprising two modularbays and an intersection board, representing an embodiment of theinvention.

FIGS. 9A and 9B illustrate schematic views of a chassis comprising twomodular bays and a module, representing an embodiment of the invention.

DESCRIPTION OF ILLUSTRATIVE EMBODIMENTS I. The Invention

The invention and the various features and advantageous details thereofare explained more fully with reference to the nonlimiting embodimentsthat are illustrated in the accompanying drawings and detailed in thefollowing description of preferred embodiments. Descriptions of wellknown components and processing techniques are omitted so as not tounnecessarily obscure the invention in detail.

Referring to FIG. 8, a chassis is depicted comprising two module baysections, including two module bay forward sections 30 and two modulebay rearward sections 31. There can be 2, 3, 4, 5, 6, 7, 8, 9, 10, 11,12, 13, 14, 15, 16, 17, 18, 19, 20, 25, 30, 40, or more forward andrearward module bay sections in the chassis. The forward and rearwardsections comprise the area between the front of the chassis and theintersection board 34 and the area between the intersection board 34 andthe rear of the chassis. The chassis comprises an intersection board 34between the forward and rearward module bay sections. If theintersection board 34 is placed substantially symmetrically between theforward 30 and rearward 31 module bay sections, it is also referred toas a midplane board. The intersection board 34 may be located in anyplane in the interior of the chassis between the front 40 and the rear41 of the chassis. The intersection board 34 may be located about 10%,about 20%, about 25%, about 30%, about 40%, about 50%, about 60%, about70%, about 75%, about 80%, or about 90% of the way from the front of thechassis 40 to the rear of the chassis 41. The intersection board 34 isshown extending the entire width of the chassis. The intersection board34 in FIG. 8 will extend at least a portion of the interior width of thechassis; it may extend the width of less than about 10%, about 20%,about 30%, about 40%, about 50%, about 60%, about 70%, about 80%, about90%, or about 100% of the interior chassis width. The height of theintersection board 34 shown in FIG. 8 is less than the interior heightof the chassis. The height may be about 0.1, about 0.2, about 0.3, about0.4, about 0.5, about 0.6, about 0.7, about 0.8, or about 0.9 times theinterior height of the chassis.

There is no difference between the forward and rearward sections of thechassis as demonstrated in FIG. 8. The terms “front” or “forward” and“rear”, “back”, or “rearward” when referring to the chassis are notrelated to the orientation of the chassis in a room or to theorientation relative to the force of gravity. These terms are usedsolely for the convenience of demarcation and communicating relativepositions within the chassis. If a chassis of the current invention isrotated 180° and the “front” and “rear” are relabeled, there would be nofunctional difference between the chassis before rotation and thechassis after rotation.

Still referring to FIG. 8, the intersection board 34 can be a virtualintersection board. A virtual plane is created when a plurality ofmodules are coupled to each other. Modules at least in-part within theforward and the rearward sections of a modular bay or at least in-partwithin adjacent modular bays may be connected to each other instead ofan intersection board. These electronic connectors create a virtualplane within the chassis which extends in a direction substantiallyparallel to the front and rear faces of the chassis. It is contemplatedthat the virtual intersection board 34 span a portion of the interiorwidth of the chassis. For example, a module located at least in-partwithin a forward section of a module bay can be electronically coupledat a point located substantially symmetrically between the front of thechassis and the back of the chassis to a module located at least in-partwithin the rearward bay section of the chassis. Modules in adjoiningmodule bay sections may or may not also be electronically coupled toeach other or to the modules previously described. To couple modules inadjoining bay sections, it would be required to have a connector on themodules facing substantially orthogonal to the direction of insertionfor the module such that the connector would contact a similar connectorwhen a module was inserted into an adjacent modular bay. The height,width, and location within the chassis of the virtual intersection board34 may be varied similarly to that of an intersection board. The virtualintersection board 34 may be located about 10%, about 20%, about 25%,about 30%, about 40%, about 50%, about 60%, about 70%, about 75%, about80%, or about 90% of the way from the front of the chassis to the rearof the chassis. The virtual intersection board 34 will extend at least aportion of the interior width of the chassis; it may extend the width ofless than about 10%, about 20%, about 30%, about 40%, about 50%, about60%, about 70%, about 80%, about 90%, or about 100% of the interiorchassis width. The height of the virtual intersection board 34 is lessthan the interior height of the chassis. The height may be about 0.1,about 0.2, about 0.3, about 0.4, about 0.5, about 0.6, about 0.7, about0.8, or about 0.9 times the interior height of the chassis.

An additional board, an intermediate board, may be coupled to thechassis. The intermediate board is located either between theintersection board 34 and the front of the chassis or between theintersection board 34 and the rear of the chassis. For example, anintersection board may be located substantially symmetrically between afront of the chassis and a back of the chassis. An intermediate boardmay be located substantially symmetrically between an intermediate boardand a back of the chassis. The intermediate board may also be a virtualintermediate board. For example, the intermediate board may be solidstate while the intersection board is be virtual or both theintermediate board and the intersection board are virtual. More than oneintermediate board may be located within a chassis.

Referring to FIG. 9A, a chassis is shown with a module 50 positioned tobe inserted into both a forward 30 and a rearward 31 modular baysection. The module 50 positioned to be inserted into the rearwardmodular bay section 31 is shown as a solid component and the module 50positioned to be inserted into the forward modular bay section is shownby dotted lines. The module 50 comprises two different heights such thatthe height of the end of the module inserted into the module bay firstis less than the height of the end of the module that will contact thechassis last. Connectors 51, represented by the diamond and square inthe upper part of the module, can connect to the intersection board oran intermediate board within the chassis. The connectors 51 can alsoconnect to another module to create a virtual intersection board. It iscontemplated that the connectors on the module could be positioned atvarious positions between the two ends of the module. For example, theconnector could be halfway between ends of the module as shown in FIG.9A. The connectors could be located about 10%, about 20%, about 30%,about 40%, about 50%, about 60%, about 70%, about 80%, or about 90% ofthe way from end of the module that is inserted into the module bay.

Although FIG. 9A is drawn such that any intersection board must belocated in the upper half of the chassis to connect to the module 50, itis understood that the designations of top and bottom can easily bereversed. A chassis of the current invention with an intersection boardlocated at the bottom of the chassis would require the module 50 shownin FIG. 9A to be vertically flipped 180° before insertion into thechassis.

Referring to FIG. 9B, the chassis and module 50 of FIG. 9A is shownafter insertion of the module 50. The orientation of the inserted module50 is depicted in FIG. 9A as having solid lines. A repositionable plate20 is shown in an orientation for connection through one or moreconnectors 52 with the chassis and module 50. The repositionable plate20 is configured such that it can be connected to the chassis via platemounting brackets located on the module bays of the chassis. If a module50 is inserted into the front of the chassis, the repositionable platewould then be connected to the chassis and module 50 from the back ofthe chassis. The repositionable plate comprises a plurality of elements53 which can include manually actuatable fasteners such as thumb screws,ventilation slots and electrical feedthroughs which are capable ofconducting power or communicating data.

A repositionable plate is modular in nature. Repositionable plates caninterchangeably be connected to the module bays of the chassis. Arepositional plate may be sized to connect to 1, 2, 3, 4, 5 or moremodule bays. It can be seen from FIGS. 2A-2C and 4A-4C that therepositionable plate of FIGS. 4A-4C is twice the width of therepositionable plate of FIGS. 2A-2C. Similarly, the module of FIGS.3A-3C is twice the width of the module of FIGS. 1A-1C. It is an aspectof the current invention that one module and/or one repositionable plateis connected to a plurality of modular bays.

It is not necessary that a repositionable plate connected to a chassisbe connected to a module located in the modular bay directly behind therepositionable plate. The repositionable plate may be connected to amodule located in any of the module bays in the chassis by means ofwires, cables, or other connectors in the interior of the chassis. Thisallows for the placement of connections external to the chassis intomore preferred positions without creating a “rats nest” of wires.

The particular material used for the repositionable plates should bestrong and durable. Conveniently, the repositionable plates of theinvention can be made of any metal material. If a conductive material isused, it is preferred that the material be coated with an insulatinglayer such as, for example, paint. For the manufacturing operation, itis an advantage to employ a cold rolled sheet steel material.

However, the particular material selected for the repositionable platesis not essential to the invention, as long as it provides the describedfunction. Normally, those who make or use the invention will select thebest commercially available material based upon the economics of costand availability, the expected application requirements of the finalproduct, and the demands of the overall manufacturing process.

The particular manufacturing process used for fabricating therepositionable plates should be inexpensive and reproducible.Conveniently, the manufacture of the repositionable plates of theinvention can be carried out by using any sheet metal fabricationmethod. If sheet metal is used, it is preferred that the processingstart with perforating, followed by forming, and then optional paintingand attachment of hardware (e.g., feed-throughs, thumbscrews,etceteras).

However, the particular manufacturing process used for making therepositionable plates is not essential to the invention as long as itprovides the described functionality. Normally those who make or use theinvention will select the manufacturing process based upon tooling andenergy requirements, the expected application requirements of the finalproduct, and the demands of the overall manufacturing process.

The invention can also be included in a kit. The kit can include some,or all, of the components that compose the invention. More specifically,the kit can include a chassis, the module bay sections and othercomponents of the invention. The kit can also include an intersectionboard or an intermediate board. The kit can also contain instructionsfor practicing the invention and apparatus for carrying out theinvention. Unless otherwise specified, the components (and apparatusand/or instructions) of the kit can be the same as those used in theinvention.

The term substantially, as used herein, is defined as at leastapproaching a given state (e.g., preferably within 10% of, morepreferably within 1% of, and most preferably within 0.1% of). The termcoupled, as used herein, is defined as connected, although notnecessarily directly, and not necessarily mechanically. The termdeploying, as used herein, is defined as designing, building, shipping,installing and/or operating. As used in the specification, “a” or “an”mean one or more. As used in the claim(s), when used in conjunction withthe word “comprising”, the words “a” or “an” mean one or more than one.As used herein “another” may mean at least a second or more.

II. EXAMPLES

Specific embodiments of the invention will now be further described bythe following, nonlimiting examples which will serve to illustrate insome detail various features of significance. The examples are intendedmerely to facilitate an understanding of ways in which the invention maybe practiced and to further enable those of skill in the art to practicethe invention. Accordingly, the examples should not be construed aslimiting the scope of the invention.

Example 1

Referring to FIGS. 1A-1C, the module comprises at least one manuallyactuatable fastener 10 located at the closed end of the module 12 or thecommunicating end of the module 14. A power connector 11 is connected atthe midpoint of the module. A fan 21, an RF connector 23, and at leastone optical connector 25 are located at the communicating end of themodule 14. A variety of other elements may also be located at thecommunicating end of the module 14. The power connector 11 can belocated at various positions between the closed end 12 and thecommunicating end 14 of the module.

The repositionable plate 20 which is configured for connection to themodule of FIGS. 1A-1C is depicted in FIGS. 2A-2C. The repositionableplate comprises manually actuatable fasteners 10, a plurality ofventilation slots 22 which can be operationally connected to the fan 21,an RF feed-through 24 which can be operationally connected to a RFconnector 23, and at least one optical feed-through 26 each of which canbe independently operationally connected to optical connectors 25. Therepositionable plate 20 of FIGS. 2A-2C can be connected to thecommunicating end of the module 14 of FIGS. 1A-1C and to the platemounting bracket on a chassis. The repositionable plate 20 is removablewithout tools, and can include a plurality of manually actuatablefasteners, an electrical feedthrough, and a plurality of ventilationslots.

Example 2

Referring to FIGS. 3A-3C, the power supply module comprises at least onemanually actuatable fastener 10 located at the closed end of the module12 or the communicating end of the module 14. A plurality of powerconnector 11 are connected at the midpoint of the module. A fan 21 andan AC inlet 27 are located at the communicating end of the module 14. Avariety of other elements may also be located at the communicating endof the module 14. As in FIGS. 1A-1C, the power connector 11 can belocated at various positions between the closed end 12 and thecommunicating end 14 of the module.

The repositionable plate 20 which is configured for connection to themodule of FIGS. 3A-3C is depicted in FIGS. 4A-4C. The repositionableplate comprises manually actuatable fasteners 10, a plurality ofventilation slots 22 which can be operationally connected to a fan 21and an electric feed-through 28 which can be operationally connected toan AC inlet 27. The repositionable plate 20 of FIGS. 4A-4C may beconnected to the communicating end of the module 14 of FIGS. 2A-2C andto the plate mounting bracket on a chassis.

Example 3

Referring to FIGS. 5A-5C, a chassis is depicted comprising a pluralityof module bay sections, including a plurality of module bay forwardsections 30 and a plurality of module bay rearward sections 31.Repositionable plate mounting brackets 38 are connected to the chassisat the outside edge of each module bay forward sections 30 and modulebay rearward sections 31. A plurality of connectors 36 are locatedbetween the forward and rearward module bay sections and are used forconnection modules to the module bay sections 30-31. 16 modular baysections are shown in FIGS. 5A-5C, any of which could be described as afirst or second modular bay section. The location of the first andsecond modular bay sections within the chassis is not important to theinvention. Card guides 45 are positioned near the bottom cover 51 of thechassis and are used for guiding modules into the module bay sections30-31. On the exterior of the chassis optional cabinet mounts 52,handles 53 and a rack mount 54 are included. The chassis can be coupledto a rack 60 via the rack mount 54. and are used for connecting modulesto the module bay sections 30-31. 16 modular bay sections are shown inFIGS. 5A-5C, any of which could be described as a first or a secondmodular bay section. The location of the first and second modular baysection within the chassis is not important to the invention. Cardguides 45 are positioned near the bottom cover 51 of the chassis and areused for guiding modules into the module bay sections 30-31. On theexterior of the chassis optional cabinet mounts 52, handles 53 and arack mount 54 are included.

Still referring to FIGS. 5A-5C, an intersection board 34 is mechanicallycoupled to the chassis with front holders 32 and rear holders 33. Theintersection board 34 is orthogonal to the front and rear faces of thechassis. As depicted midway between the front and the rear of thechassis, the intersection board 34 can also be described as a midplaneboard. The intersection board 34 can also be located at differentdistances between the front and rear of the chassis. The only differencebetween the “forward” and “rearward” sections of the chassis is thatthere are exterior handles and cabinet mount on the exterior of theforward section.

Example 4

Referring to FIGS. 6A and 6B, a side view of the chassis is shown with apower supply module inserted in a module bay wherein the communicatingend 14 of the module is in operational engagement with a repositionableplate 20. The power supply module in FIGS. 6A and 6B is identical to thepower supply module described in example 2. One or more manuallyactuatable fasteners 10 are used to couple the repositionable plate 20to the repositionable plate mounting bracket 38 on the chassis. Thepower supply module is coupled to the module bay through a connectionbetween the power connector 11 and the intersection board 34.

FIG. 6A illustrates the chassis with the module inserted from the front.FIG. 6B illustrate the chassis with the module inserted from the back.In FIGS. 6A and 6BA, the module is inserted into a modular bay from thefront of the chassis. The repositionable plate 20 is operationalcontacted with the communicating end 14 of the module and connected tothe rear of the chassis 41 using a repositionable plate mounting bracket38.

In FIGS. 6A and 6B, the module is inserted into a modular bay from therear of the chassis. The repositionable plate 20 is operationallycontacted with the communicating end 14 of the module and connected tothe front of the chassis 40 using a repositionable plate mountingbracket 38.

Example 5

Referring to FIGS. 7A and 7B, a side view of the chassis is shown with amodule inserted in a module bay wherein the communicating end 14 of themodule is in operational engagement with a Repositionable plate 20. Themodule in FIGS. 7A and 7B is identical to the module described inexample 1. One or more manually actuatable fasteners 10 are used tocouple the repositionable plate 20 to the repositionable plate mountingbracket 38 on the chassis. The power supply module is coupled to themodule bay through a connection between the power connector 11 and theintersection board 34.

FIG. 7A illustrate the chassis with the module inserted from the front.FIG. 7B illustrate the chassis with the module inserted from the back.

In FIG. 7A, the module is inserted into a modular bay from the front ofthe chassis. The repositionable plate 20 is operationally contacted withthe communicating end 14 of the module and connected to the rear of thechassis 41 using a repositionable plate mounting bracket 38.

In FIG. 7B, the module is inserted into a modular bay from the front ofthe chassis. The repositionable plate 20 is operationally contacted withthe communicating end 14 of the module and connected to the front of thechassis 40 using a repositionable plate mounting bracket 38.

Practical Applications of the Invention

A practical application of the invention that has value within thetechnological arts is rack mounted electrical equipment. The inventionis useful in conjunction with communication networks, (e.g. LAN, MANand/or WAN). There are virtually innumerable uses for the invention, allof which need not be detailed here.

Advantages of the Invention

A chassis representing an embodiment of the invention, can be costeffective and advantageous for at least the following reasons.

The intermediate board or virtual intermediate board allows for agreater variety of positions for placement of the modular components.This greatly increases the versatility of the modular system. Thisinvention allows for a high density of modules to be placed in achassis, reducing the number of chassis and thereby the cost required inan electrical system.

The ability to separate the module from the back plate allows forreplacement of only the part which needs replacement. The availabilityof a variety of positions for placement of both the modules and therepositionable plates allows for a versatility in the chassisconfiguration not allowable with the prior art. The reduction in numberof wires external to the chassis (i.e., removing a “rat's nest”) reducesthe amount of time required to trace wires or cables to find necessaryconnections when reconfiguring the electrical system.

The intermediate board or virtual intermediate board allows for agreater variety of positions for placement of the modular components.This greatly increases the versatility of the modular system. Thisinvention allows for a high density of modules to be placed in achassis, reducing the number of chassis and thereby the cost required inan electrical system.

All the embodiments of the invention disclosed and claimed herein can bemade and executed without undue experimentation in light of the presentdisclosure. While the compositions and methods of this invention havebeen described in terms of preferred embodiments, it will be apparent tothose of skill in the art that variations may be applied to the methodsand in the steps or in the sequence of steps of the method describedherein without departing from the concept, spirit and scope of theinvention. Accordingly, it will be appreciated by those skilled in theart that the invention may be practiced otherwise than as specificallydescribed herein.

For example, the individual components need not be formed in thedisclosed shapes, or assembled in the disclosed configuration, but couldbe provided in virtually any shape, and assembled in virtually anyconfiguration. Further, the individual components need not be fabricatedfrom the disclosed materials, but could be fabricated from virtually anysuitable materials. Further, although the chassis, repositionable platesand modules described herein can be physically separate, it will bemanifest that the chassis, repositionable plates and modules may beintegrated into the apparatus with which they are associated.Furthermore, all the disclosed elements and features of each disclosedembodiment can be combined with, or substituted for, the disclosedelements and features of every other disclosed embodiment except wheresuch elements or features are mutually exclusive.

It will be manifest that various additions, modifications andrearrangements of the features of the invention may be made withoutdeviating from the spirit and scope of the underlying inventive concept.It is intended that the scope of the invention as defined by theappended claims and their equivalents cover all such additions,modifications, and rearrangements.

The appended claims are not to be interpreted as includingmeans-plus-function limitations, unless such a limitation is explicitlyrecited in a given claim using the phrase “means for” or “step for.”Expedient embodiments of the invention are differentiated by theappended subclaims.

What is claimed is:
 1. An apparatus comprising: a chassis including afirst plate mounting bracket and a second plate mounting bracket, saidchassis defining a first module bay and a second module bay; arepositionable plate removably connected to said first plate mountingbracket and removably connectable to said second plate mounting bracket;and a module inserted and positioned at least in part within said firstmodule bay, coupled to said repositionable plate, and separatable fromsaid repositionable plate while said repositionable plate remainsremovably connected to said first plate mounting bracket allowingreplacement of only a part that needs replacement, wherein saidrepositionable plate includes an electrical feedthrough.
 2. An apparatuscomprising: a chassis including a first plate mounting bracket and asecond plate mounting bracket, said chassis defining a first module bayand a second module bay; a repositionable plate removably connected tosaid first plate mounting bracket and removably connectable to saidsecond plate mounting bracket; and a module inserted and positioned atleast in part within said first module bay, coupled to saidrepositionable plate, and separatable from said repositionable platewhile said repositionable plate remains removably connected to saidfirst plate mounting bracket allowing replacement of only a part thatneeds replacement, wherein said chassis includes a midplane board.
 3. Amethod, comprising: providing a chassis with a first plate mountingbracket and a second plate mounting bracket, said chassis defining afirst module bay and a second module bay; connecting a repositionableplate to said first plate mounting bracket, said repositionable plateremovable from said first plate mounting bracket and removablyconnectable to said second plate mounting bracket; inserting andpositioning a module at least in part within said first module bay;coupling the module to said repositionable plate; and positioning amodule within said first module bay and electrically coupling saidmodule to said repositionable plate, wherein the module is separatablefrom said repositionable plate while the repositionable plate remainsconnected to the first plate mounting bracket allowing replacement ofonly a part that needs replacement.
 4. A method, comprising: providing achassis with a first plate mounting bracket and a second plate mountingbracket, said chassis defining a first module bay and a second modulebay; connecting a repositionable plate to said first plate mountingbracket, said repositionable plate removable from said first platemounting bracket and removably connectable to said second plate mountingbracket; inserting and positioning a module at least in part within saidfirst module bay; coupling the module to said repositionable plate; andwherein the module is separatable from said repositionable plate whilethe repositionable plate remains connected to the first plate mountingbracket allowing replacement of only a part that needs replacement,forcing air through ventilation slots located in said repositionableplate.
 5. A method, comprising: providing a chassis with a first platemounting bracket and a second plate mounting bracket, said chassisdefining a first module bay and a second module bay; connecting arepositionable plate to said first plate mounting bracket, saidrepositionable plate removable from said first plate mounting bracketand removably connectable to said second plate mounting bracket;inserting and positioning a module at least in part within said firstmodule bay; coupling the module to said repositionable plate; andwherein the module is separatable from said repositionable plate whilethe repositionable plate remains connected to the first plate mountingbracket allowing replacement of only a part that needs replacement,conducting power through an electric feedthrough located in saidrepositionable plate.
 6. A method, comprising: providing a chassis witha first plate mounting bracket and a second plate mounting bracket, saidchassis defining a first module bay and a second module bay; connectinga repositionable plate to said first plate mounting bracket, saidrepositionable plate removable from said first plate mounting bracketand removably connectable to said second plate mounting bracket;inserting and positioning a module at least in part within said firstmodule bay; coupling the module to said repositionable plate; andcommunicating data through an electric feedthrough located in saidrepositionable plate, wherein the module is separatable from saidrepositionable plate while the repositionable plate remains connected tothe first plate mounting bracket allowing replacement of only a partthat needs replacement.
 7. A kit, comprising; a chassis including afirst plate mounting bracket and a second plate mounting bracket, saidchassis defining a first module bay and a second module bay; arepositionable plate removably connected to said first plate mountingbracket and removably connectable to said second plate mounting bracket;and a module inserted and positioned at least in part within said firstmodule bay, coupled to said repositionable plate, and separatable fromsaid repositionable plate while said repositionable plate remainsremovably coupled to said first plate mounting bracket allowingreplacement of only a part that needs replacement, wherein said chassisincludes a midplane board.